As ICs pack more devices per chip and run at higher clock speeds, shrinking geometries, new materials, and novel technologies are pushing reliability testing further upstream. Although reliability can still be evaluated at the packaged device level, many IC makers are migrating to wafer level testing, which reduces time, production loss, cost, and material waste when packaged devices fail.

This application note explains how Keithley’s 4200A SCS parameter analyzer and package options provide the hardware and software needed for faster, more sensitive, and highly flexible wafer level reliability testing.

Download this practical guide to learn how to shorten time to market while achieving robust device characterization and reliability evaluation.